Stamping parts

ttop corp. is focus in lead frame stamping and, with years of industry experience and advanced manufacturing technologies, delivers high-quality, high-efficiency, and cost-competitive lead frame products. We have earned the trust of semiconductor packaging and electronics customers both domestically and internationally. Our core advantages are as follows:

1. Advanced Equipment and Automated Production
We utilize high-speed precision stamping machines to ensure excellent dimensional accuracy and product consistency.

2. High-Precision Tooling Development
We have in-house capabilities for Die & Molds design and build-up, enabling quick response to customized our customer needs. Our long tool life and fast maintenance reduce the risk of production downtime.

3. Diverse Material Processing and Flexible Supply
We can process a wide range of materials to meet different packaging applications. Long-term partnerships with material suppliers ensure stable supply and competitive pricing.

4. Rigorous Quality Management
Certified under ISO 9001 and IATF 16949 quality management systems. We implement full-process traceability and quality monitoring, with 100% appearance and dimensional inspection before shipment.

5. Fast Delivery and Flexible Production Capability
Our flexible scheduling system allows us to accommodate urgent requests and small-volume, high-mix production orders.

6. Customized Service and Technical Support
We provide one-stop services from sample development and tooling design to mass production. Our engineering team assists customers in optimizing lead frame structure to enhance packaging efficiency and reliability.